Ephraim Suhir
Department of Electrical Engineering, UC Santa Cruz
Physical design, reliability and packaging of micro- and optoelectronic systems; materials engineering; applied probability; predictive modeling; nano-materials and nano-engineering; fiber-optic systems; shock and vibration analyses; thermal stresses; thin films; bonded joints.
(831) 459-5453 | SuhirE@aol.com | UC Santa Cruz
Scientific and Professional Membership
Dr. Suhir is Distinguished Member of Technical Staff (ret), Physical Sciences and Engineering Research Division, Bell Labs, Murray Hill, NJ. Currently he is on the faculty of the Electrical Engineering Department, University of California, Santa Cruz, CA, where he taught/teaches courses "Fundamentals of Optoelectronics and Photonics" and "Basics of Electronic Reliability." He is also Visiting Professor, Department of Mechanical Engineering, University of Maryland, College Park, MD. Dr. Suhir is Fellow of five leading professional societies: the Institute of Electrical and Electronics Engineers (IEEE), the American Physical Society (APS), the Institute of Physics (IoP), UK, the American Society of Mechanical Engineers (ASME), and the Society of Plastics Engineers (SPE). He has formed, and is chairing, the IEEE TAB NTDC Group on Portable Information Devices (PIDs), and the IEEE Vehicular Technology Society (VTS) Technical Committee on PIDs. Dr. Suhir is a co-founder of the ASME Journal of Electronic Packaging and served as its Technical Editor (Editor-in-Chief) for eight years (1993-2001). Dr. Suhir holds 19 US patents and has authored about 250 technical publications (papers, book chapters, books), including monographs "Probabilistic Methods in Ship Structural Analysis and Design", Nikolaev Institute of Naval Architecture, Nikolaev, Ukraine, 1973 (in Russian), "Structural Analysis in Microelectronics and Fiber Optics", Van-Nostrand, 1991, "Applied Probability for Engineers and Scientists", McGraw-Hill, 1997, and recent Springer publication E. Suhir, CP Wong, YC Lee, eds. "Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability", Springer, 2007. Dr. Suhir is editor of the Springer book series on physics, mechanics, design-for-reliability and packaging of microelectronic and photonic systems.
Dr. Suhir is Member of the Board of Governors and Distinguished Lecturer of the IEEE CPMT (Components, Packaging and Manufacturing Technology) Society, serves on several Technical Committees of this Society and is Associate Editor of the IEEE CPMT Transactions on Advanced Packaging, and ISAST (International Society for Advanced Science and Technology) Transactions, Finland. Dr. Suhir organized many successful conferences, workshops and symposia in the USA, Europe and Far East countries, and presented numerous keynote and invited talks worldwide. ng Technology) Society, serves on several Technical Committees of this Society and is Associate Editor of the IEEE CPMT Transactions on Advanced Packaging, and ISAST (International Society for Advanced Science and Technology) Transactions, Finland. Dr. Suhir organized many successful conferences, workshops and symposia in the USA, Europe and Far East countries, and presented numerous keynote and invited talks worldwide.
Honors and Awards
Dr. Suhir received numerous distinguished service and professional awards. Some of his recent awards are:
- 2004 ASME Worcester Read Warner Medal for outstanding contributions to the permanent literature of engineering through a series of papers in Mechanical, Microelectronic, and Optoelectronic Engineering, which established a new discipline known as the Structural Analysis of Microelectronic and Photonic Systems
- 2001 IMAPS John A. Wagnon Technical Achievement Award for outstanding contributions to the technical knowledge of the microelectronics, optoelectronics, and packaging industry
- 2000 IEEE-CPMT Outstanding Sustained Technical Contribution Award for outstanding, sustained and continuing contributions to the technologies in fields encompassed by the CPMT Society
- 2000 SPE International Engineering/Technology (Fred O. Conley) Award for outstanding pioneering and continuing contributions to plastics engineering
- 1999 ASME and Pi-Tau-Sigma Charles Russ Richards Memorial Award for outstanding contributions to mechanical engineering, and 1996 Bell Laboratories Distinguished Member of Technical Staff Award for developing extremely accurate and robust engineering mechanics methods for predicting the reliability, performance, andmechanical behavior of complex structures used in manufacturing Lucent Technologies products.
Recent Papers
- E. Suhir, “Lateral Compliance of a Compressed Cantilever Beam, with Application to Micro-Electronic and Fiber-Optic Structures”, Journal of Applied Physics D, vol.41, No.1, 2008
- T. Mirer, D. Ingman, E. Suhir, “Reliability Improvement through Nano-Particle-Material-Based Fiber Structures”, Optical Fiber Technology, v. 13, 2007, pp.27-31.
- E. Suhir, “Elastic Stability of a Dual-Coated Optical Fiber of Finite Length”, Journal of Applied Physics, vol.102, No.5, 2007
- E. Suhir, “Elastic Stability of a Dual-Coated Optical Fiber with a Stripped Off Coating at Its End”, Journal of Applied Physics, vol. 102, No.4, 2007
- E. Suhir, “Response of a Heavy Electronic Component to Harmonic Excitations Applied to Its External Electric Leads”, Elektrotechnik & Informationstechnik (Austria), vol.9, 2007
- E, Suhir, “Dynamic Response of Micro-Electronic Structural Elements to Shocks and Vibrations”, Keynote presentation, MicroNanoReliability Congress, Berlin-Koepenick, September 2-5, 2007
- E. Suhir, “Polymeric Coating of Optical Silica Fibers, and a Nanomaterial-Based Coating System”, Key-Note Presentation, Polytronic?2007, Proceedings of the International Conference on Polymeric Materials for Micro-and Opto-Electronics Applications, Tokyo, Japan, January 14-16, 2007
- E.Suhir, “Interfacial Thermal Stresses in a Bi-Material Assembly with a Low-Yield-Stress Bonding Layer”, Modeling and Simulation in Materials Science and Engineering, vol. 14, 2006, pp.1421-1432
- Yuan Xu, Yi Zhang, Ephraim Suhir, and Xinwei Wang, “Thermal Properties of Carbon Nanotube Array for Integrated Circuits Cooling”, Journal of Applied Physics,100, 074302, 2006
- Yi Zhang, Yuan Xu and Ephraim Suhir, “Effect of Rapid Thermal Annealing (RTA) on Thermal Properties of Carbon Nanofibre (CNF) Arrays”, Journal of Physics D: Applied Physics ,39, 2006, pp.4878-4885
- Yi Zhang, Yuan Xu and Ephraim Suhir, “Effective Young’s Modulus of Carbon Nanofiber Array” Journal of Materials Research,vol.21, No.11, Nov. 2006
- Yi Zhang, Ephraim Suhir, Yuan Xu, and Claire Gu, “Bonding Strength of Carbon Nanofiber Array to its Substrate” Journal of Materials Research, vol. 21, No.11, Nov.2006
- Yi. Zhang, Yuan Xu, Claire. Gu and Ephraim Suhir, “Predicted Shear-off Stress in Bonded Assemblies: Review and Extension? ASTR 2006, San Francisco, CA
- E. Suhir, “Fiber Optics Structural Mechanics, and a New Generation of Nano-Technology Based Optical Fiber Cladding and Coating”, Invited talk at the Photonics West Conf., and SPIE Publication, 2006
Patents
- Dov Ingman, Vladimir Ogenko, Ephraim Suhir, Andrew Glista, "Moisture-Resistant Nano-Particle Material and Its Applications", US Patent #7,321,714B2, 2008
- 2. E. Suhir, “Apparatus and Test Device for the Application and Measurement of Prescribed, Predicted and Controlled Contact Pressure on Wires”, US Patent #7,279,916, 2007
- 3. D. Ingman and E.Suhir, “Optical Fiber with Nano-Particle Overclad”, US Patent, #7,162,138 B2, 2007
- 4 D. Ingman and E.Suhir, “Optical Fiber with Nano-Particle Cladding”, US Patent, #7,162,137 B2, 2007
- 5. E. Suhir, “Coated Optical Glass Fiber”, US Patent #6,647,195, 2003
- 6. E.Suhir, “Optical Fiber Interconnects Having Offset Ends with Reduced Tensile Strength and Fabrication Method”, US Patent #6,606,434, 2003
- 7. E. Suhir, “Bi-Material Assembly Adhesively Bonded at the Ends and Fabrication Method”, US Patent #6,460, 753, 2002
- 8. E. Suhir, “Strain Free Planar Optical Waveguides”, US Patent #6,389,209, 2002
- 9. E. Suhir, “Apparatus and Method for Thermostatic Compensation of Temperature Sensitive Devices”, US Patent #6,337,932, 2002